Hernandez Morales, Guillermo |
Mexico |
FSPMEX 190606 003
|
Process
|
Jun 21, 2019
|
Hernández Sánchez, José Antonio |
Mexico |
FSPMEX 230918 004
|
Process
|
Oct 05, 2023
|
Hernandez Silva, Chrystian |
Mexico |
FSPMEX 190606 004
|
Process
|
Jun 21, 2019
|
Hernández Villafana, Luis Fernando |
Mexico |
FSPMEX 170928 009
|
Process
|
Oct 10, 2017
|
Herrera, Alexis |
USA |
FSPME 160505 002
|
Process
|
May 19, 2016
|
Herrera, Victor Manuel |
Mexico |
FSPMEX 210614 003
|
Process
|
Oct 05, 2023
|
Herrin, Joey |
USA |
FSPUSA 190818 001
|
Process
|
Aug 21, 2019
|
Herrler, Brian |
USA |
FSPUSA 170622 003
|
Process
|
Jan 29, 2018
|
Herrmann, Ulrich |
Germany |
FSP DE220518 601
|
Automotive – Software
|
Aug 01, 2022
|
Hertzog, Alexandre |
Germany |
FSP DE220324 602
|
Automotive – Software
|
Apr 20, 2022
|
Herzenjak, Nejc |
Germany |
FSP DE231121 603
|
Automotive
|
Feb 07, 2024
|
Hes, Andras |
Germany |
FSP DE180620 008
|
Automotive – Software
|
Jul 11, 2018
|
Hess, Sue |
USA |
FSPUS 171118 012
|
Automotive
|
Nov 27, 2017
|
Hesselbarth, Sebastian |
Germany |
FSP DE201022 108
|
Automotive/Semiconductors
|
Nov 03, 2020
|
Hester, Ian |
Australia |
FSPAU 190808 004
|
Process
|
Aug 14, 2019
|
Heun, Oliver |
Germany |
FSP DE180620 005
|
Automotive – Software
|
Jul 11, 2018
|
Heuser, Daniel |
Germany |
FSPDE 170629 002
|
Automotive
|
Jul 17, 2017
|
Hierzenhofer, Joachim |
Germany |
FSP DE220218 606
|
Automotive
|
Mar 08, 2022
|
Higginbotham, Aaron |
USA |
FSP 150917 001
|
Process
|
Sep 21, 2015
|
Hikory, Emmet |
United Kingdom |
FSPUK 220616 014
|
Automotive
|
Jun 30, 2022
|
Hildenbrandt, Kate |
USA |
FSPUSA 170427 004
|
Process
|
May 02, 2017
|
Hill, Jane |
United Kingdom |
FSPUK 151119 006
|
Process
|
Feb 18, 2016
|
Hille, Toni |
Germany |
FSPDE 181026 010
|
Automotive
|
Dec 06, 2018
|
Hillenaar, Maarten |
Sweden |
FSPSWE 240328 014
|
Process
|
Apr 12, 2024
|
Hillenbrand, Dominic |
United Kingdom |
FSPGB 180110 031
|
Automotive / Semiconductors
|
Aug 30, 2019
|
Hillenbrand, Marco |
Germany |
FSP DE231129 603
|
Automotive
|
Feb 07, 2024
|
Hiller, Alexander |
Germany |
FSP DE221021 613
|
Automotive – Software
|
Mar 03, 2023
|
Himawan, Reynaldo |
Australia |
FSPAU 200910 007
|
Machine Safety
|
Sep 21, 2020
|
Hinojosa, Bianca |
USA |
FSPUSA 230928 006
|
Process
|
Oct 02, 2023
|
Hirekana Vangala, Sanjaya |
United Kingdom |
FSPUK 210326 010
|
SIL Verification with exSILentia
|
Mar 31, 2021
|
Hnin, Wai Yin |
Germany |
FSP DE210708 202
|
Automotive - Hardware
|
Jan 25, 2022
|
Ho, Ling-I |
Taiwan |
FSP TW170817 009
|
Process
|
Aug 25, 2017
|
Ho, Po-Yen |
Taiwan |
FSP TW170817 022
|
Process
|
Aug 25, 2017
|
Ho, Yeow Hsing Sunny |
Singapore |
FSPSG 220901 007
|
Process
|
Sep 06, 2022
|
Ho Bae, Joon |
United Kingdom |
FSPUK 211008 011
|
Process Industry Hardware acc. to IEC 61508
|
Oct 21, 2021
|
Hoang, Khoi |
USA |
FSPUSA 181206 014
|
Process
|
Dec 17, 2018
|
Hobbie, Susan |
USA |
FSPUSA 160421 008
|
Process
|
Apr 27, 2016
|
Hochhaus, Jürgen |
USA |
FSPUSA 170316 001
|
Process
|
Apr 03, 2017
|
Hodgson, Michael |
United Kingdom |
FSPUK 151119 001
|
Process
|
Feb 18, 2016
|
Hoe, Kah Eng Jerry |
Singapore |
FSPSG 211105 002
|
Automotive
|
Nov 14, 2021
|
Hoenck, Christoph |
Germany |
FSP DE211114 601
|
Automotive
|
Jan 25, 2022
|
Hoerndl, Korbinian |
Germany |
FSP DE230324 204
|
Automotive - Hardware
|
Jul 06, 2023
|
Hofbaur, Michael |
Germany |
FSP DE210629 401
|
Process Industry Hardware acc. to IEC 61508
|
Jan 18, 2022
|
Hofer, Dr. Wanja |
Germany |
FSP 151125 002
|
Automotive
|
Dec 01, 2015
|
Hoffert, Adam |
USA |
FSPUSA 170406 004
|
Automotive
|
Apr 13, 2017
|
Hoffman , Russell |
USA |
FSPUSA 210614 005
|
Functional Safety Development
|
Jul 23, 2021
|
Hogg, Duncan |
USA |
FSPUSA 170622 007
|
Process
|
Jan 29, 2018
|
Hohner, David Silvan |
Germany |
FSP DE240216 609
|
Software Functional Safety Development
|
Mar 08, 2024
|
Holberg, Arne Martin |
Norway |
FSP NO220422 107
|
Automotive / Semiconductors
|
May 11, 2022
|
Hold, Betina |
USA |
FSPUSA 191010 006
|
Automotive / Semiconductors
|
Oct 18, 2019
|
Holden , Nicholas |
Ireland |
FSPIRL 220309 002
|
Functional Safety Development
|
Apr 01, 2022
|
Holetzko, Matthias |
Germany |
FSP DE180711 002
|
Automotive – Software
|
Jul 13, 2018
|
Holguin, Jorge |
USA |
FSPUSA 221006 001
|
Functional Safety Development
|
Oct 27, 2022
|
Hollinger, Michael |
Germany |
FSP DE210217 603
|
Automotive – Software
|
Mar 02, 2021
|
Holloway, Steve |
Germany |
FSP DE210923 111
|
Automotive / Semiconductors
|
Oct 20, 2021
|
Holmquist, Dan |
USA |
FSPUSA 180507 001
|
Process
|
Jun 25, 2018
|
Holnberger, Matthias |
Germany |
FSPDE 170928 006
|
Automotive
|
Oct 06, 2017
|
Holstein, Bill |
USA |
FSPUSA 210303 004
|
Automotive / Semiconductors
|
May 05, 2021
|
Holzmann, Alexander |
Germany |
FSP DE210322 304
|
Process
|
Apr 20, 2021
|
Hommen, Markus |
Germany |
FSP DE210415 601
|
Automotive – Software
|
May 17, 2021
|
Homoka, David |
Papua New Guinea |
FSPPG 230721 017
|
Process
|
Aug 15, 2023
|
Hong, Ted |
USA |
FSPUSA 180216 002
|
Automotive / Semiconductors
|
Feb 20, 2018
|
Hong, Byungchul |
France |
FSPFR 180424 002
|
Automotive / Semiconductors
|
Apr 30, 2018
|
Hong, SeongJin |
Korea, South |
FSPKR 180619 018
|
Automotive / Semiconductors
|
Jul 03, 2018
|
Hong, Yang |
Germany |
FSP DE210916 126
|
Automotive / Semiconductors
|
Oct 07, 2021
|
Hong, Boon Yao |
Australia |
FSPAU 221110 004
|
Machine Safety
|
Nov 28, 2022
|
Hongbin, Zheng |
China |
FSPCN-230221-024
|
Automotive
|
Mar 16, 2023
|
Hongliang, Xu |
China |
FSPCN-220803-025
|
Automotive
|
Aug 03, 2022
|
Hongpeng, Nie |
China |
FSPCN-210722-014
|
Automotive
|
Aug 03, 2021
|
Hongquan, Zhu |
China |
FSPCN-220803-031
|
Automotive
|
Aug 03, 2022
|
Hongyue, Guo |
China |
FSPCN-220803-011
|
Automotive
|
Aug 03, 2022
|
Hoogstraten, Doug |
Canada |
FSPCA 220324 008
|
Process
|
Apr 01, 2022
|
Hoopes, Mark |
USA |
FSPUSA 230518 006
|
Automotive / Semiconductors
|
May 24, 2023
|
Horne, Hamish |
USA |
FSPUSA 221110 007
|
Process
|
Nov 11, 2022
|
Horner, Rita |
USA |
FSP US231117 117
|
Automotive / Semiconductors
|
Nov 27, 2023
|
Hosch , Markus |
Germany |
FSP 150702 013
|
Safety Software Development
|
Jul 07, 2015
|
Hostetter, David |
USA |
FSPUSA 170810 005
|
Process
|
Aug 30, 2017
|
Hou, Chaofei |
China |
FSP-221208-005
|
Automotive
|
Dec 20, 2022
|
Houlong, Xia |
Germany |
FSP DE210916 109
|
Automotive / Semiconductors
|
Oct 07, 2021
|
House, Scott |
USA |
FSPUSA 151210 006
|
Process
|
Dec 15, 2015
|
Howard, Eric |
Germany |
FSP DE220707 104
|
Automotive / Semiconductors
|
Aug 04, 2022
|
Howarth, Wade |
USA |
FSPUSA231214020
|
SIL Verification with exSILentia
|
Mar 08, 2024
|
Howe, Matthew |
USA |
FSPUSA 160421 010
|
Process
|
Apr 27, 2016
|
Howes, Rupert |
Germany |
FSP DE210923 110
|
Automotive / Semiconductors
|
Oct 20, 2021
|
Howes, Jake |
Singapore |
FSPSG 220304 002
|
Process
|
Mar 08, 2022
|
Hoyme, Michael |
USA |
FSPUSA 170309 007
|
Process
|
Mar 24, 2017
|
Hravanovic, Dino |
Germany |
FSP DE200617 701
|
Automotive
|
Oct 07, 2020
|
Hsia, Vincent |
USA |
FSPUSA 230518 011
|
Automotive / Semiconductors
|
May 24, 2023
|
Hsiao, Chia-Hui |
Taiwan |
FSP TW170817 039
|
Process
|
Aug 25, 2017
|
Hsieh, Ted |
Germany |
FSP DE210411 601
|
Automotive – Software
|
May 17, 2021
|
Hsieh, Blue |
Taiwan |
FSPTW 221020 017
|
Automotive – Software
|
Nov 07, 2022
|
Hsu, Hsin-Wu |
Taiwan |
FSP TW170817 008
|
Process
|
Aug 25, 2017
|
Hsu, Pei-Yu |
Taiwan |
FSP TW170817 010
|
Process
|
Aug 25, 2017
|
Hsu, Wei-Shen |
Taiwan |
FSP TW170817 011
|
Process
|
Aug 25, 2017
|
Hsu, Hunglin |
Germany |
FSP DE220707 101
|
Automotive / Semiconductors
|
Aug 04, 2022
|
Hsu, Daniel |
Singapore |
FSPSG 221216 006
|
SIL Verification with exSILentia
|
Dec 26, 2022
|
Hu, Chien-Tang |
USA |
FSPUSA 170609 034
|
Automotive / Semiconductors
|
Jun 14, 2017
|
Hu, Ching-Chung |
Taiwan |
FSP TW170817 015
|
Process
|
Aug 25, 2017
|
Hu, Haibo |
China |
FSPCN 171009 003
|
Automotive
|
Oct 10, 2017
|
Hu, Jidong |
United Kingdom |
FSPUK 180322 003
|
Process
|
Apr 04, 2018
|
Hu, Jing |
USA |
FSPUSA 180914 006
|
Automotive / Semiconductors
|
Sep 21, 2018
|
Hu, Yike |
USA |
FSPUSA 200521 002
|
Automotive
|
Jun 25, 2020
|
Hu, Runze |
China |
FSPCN-20201030-009
|
Automotive
|
Nov 09, 2020
|
Hu, Xin'an |
China |
FSP CN191204 002
|
Automotive / Semiconductors
|
Jun 07, 2021
|
Hu, Hailong |
China |
FSPCN-210701 007
|
Automotive
|
Jul 14, 2021
|
Hu, Xiang |
Singapore |
FSPSG 210909 008
|
Process
|
Sep 10, 2021
|
Hu, Jieqiong |
Singapore |
FSPSG 210909 016
|
Process
|
Sep 16, 2021
|
Hu, Runze |
Singapore |
FSPSG 211008 006
|
Process Industry Hardware acc. to IEC 61508
|
Oct 19, 2021
|
Hu, Yanqing |
China |
FSP CH211125 101
|
Automotive
|
May 10, 2022
|
Hu, Kejia |
United Kingdom |
FSPUK 220616 009
|
Automotive
|
Jun 30, 2022
|
Hu, Fan |
China |
FSPCN 221017-020
|
Automotive
|
Oct 27, 2022
|
Huan, Chen |
China |
FSP 151125 005
|
Automotive
|
Dec 04, 2015
|
Huang, XianKun |
China |
FSP 151106 012
|
Automotive
|
Nov 13, 2015
|
Huang, Jeng-Yann |
Taiwan |
FSPTW 160922 001
|
Process
|
Sep 29, 2016
|
Huang, Yi |
China |
FSPCN 160927 002
|
Automotive
|
Nov 29, 2016
|
Huang, Hsing-Chien |
Taiwan |
FSP TW170817 002
|
Process
|
Aug 25, 2017
|
Huang, Chien-Wei |
Taiwan |
FSP TW170817 018
|
Process
|
Aug 25, 2017
|
Huang, Chen-Yueh |
Taiwan |
FSP TW170817 030
|
Process
|
Aug 25, 2017
|
Huang, Chung-Wei |
Taiwan |
FSP TW170817 034
|
Process
|
Aug 25, 2017
|
Huang, Xuesheng |
China |
FSPCN 171009 019
|
Automotive
|
Oct 10, 2017
|
Huang, Brian |
France |
FSPFR 180424 003
|
Automotive / Semiconductors
|
Apr 30, 2018
|
Huang, Guanming |
USA |
FSPUSA 191010 002
|
Automotive / Semiconductors
|
Oct 18, 2019
|
Huang, Yuan |
Singapore |
FSPSG 210909 009
|
Process
|
Sep 10, 2021
|
Huang, An |
China |
FSP CN 211229 007
|
Automotive
|
Jan 11, 2022
|
Huang, Wenjie |
Australia |
FSPAU 231019 007
|
Machine Safety
|
Oct 30, 2023
|
Huang, Chuan |
China |
FSP CN231222 906
|
Automotive / Semiconductors
|
Jan 15, 2024
|
Huang, Yi Hsiang |
Taiwan |
FSPTWN 231027 002
|
Machine Safety
|
Jan 31, 2024
|
Huang, Alex |
USA |
FSPUSA240119011
|
Machine Safety
|
Mar 12, 2024
|
Huang, Erin |
USA |
FSPUSA 240315 013
|
Process
|
Mar 28, 2024
|
HuangSheng, Ding |
China |
FSP DE210716 104
|
Automotive / Semiconductors
|
Jan 18, 2022
|
Hubal, Winfried |
Germany |
FSPDE 190822 607
|
Automotive – Software
|
Oct 15, 2019
|
Huber, Ivo |
Germany |
FSP DE210923 115
|
Automotive / Semiconductors
|
Oct 20, 2021
|
Hudson, Christopher |
USA |
FSPUSA 170209 003
|
Process
|
Feb 15, 2017
|
Huetter-Hofer, Stefan |
Germany |
FSP DE210407 601
|
Automotive
|
May 17, 2021
|
Hui, Jia |
China |
FSP 150807 009
|
Automotive
|
Aug 13, 2015
|
Hui , Gao |
China |
FSPCN-210716-026
|
Automotive
|
Aug 03, 2021
|
Huihuang, Ni |
China |
FSP 150807 002
|
Automotive
|
Aug 13, 2015
|
Huihuang, Ni |
China |
FSP 150923 002
|
Automotive
|
Sep 28, 2015
|
Humphries, Neil |
USA |
FSPUSA 190523 008
|
Process
|
May 28, 2019
|
Humphries, Neil |
USA |
FSPUSA 220506 002
|
SIL Verification with exSILentia
|
May 20, 2022
|
Hung, Jen-Chien |
Taiwan |
FSP CN220326 014
|
Automotive / Semiconductors
|
Apr 06, 2021
|
Hungerford , Alan |
USA |
FSPUSA 210301 006
|
Process
|
Apr 16, 2021
|
Hunt, Deborah |
Australia |
FSPAU 180719 003
|
Machine Safety
|
Jul 24, 2018
|
Huntley, Scott |
USA |
FSPUSA 160915001
|
Process
|
Sep 29, 2016
|
Hurst, Saskia |
United Kingdom |
FSPUK 170330 005
|
Process
|
Apr 05, 2017
|
Hussain Al-Nakhli, Ahmad |
Saudi Arabia |
FSPKSA 091019 009
|
Process Hazard Analysis using HAZOP
|
Jan 28, 2020
|
Huston, Rea |
USA |
FSPUSA 210517 001
|
Process
|
Jun 08, 2021
|
Hutama, Albert |
Singapore |
FSPSG 231026 005
|
Process
|
Nov 06, 2023
|
Hutson, Dax |
USA |
FSPUSA 160310 003
|
Process
|
Mar 22, 2016
|
Hutson, Jiaxi |
China |
FSPCN 160414 006
|
Process
|
Apr 27, 2016
|
Huynh, Denny |
Canada |
FSPCA 201203 005
|
Software Functional Safety Development
|
Dec 08, 2020
|
Huynh, Kevin |
Australia |
FSPAU 211125 009
|
Machine Safety
|
Dec 01, 2021
|
Hyden, Christoph |
Germany |
FSP DE210408 604
|
Automotive
|
May 17, 2021
|
Iacob, Radu |
China |
FSPCN 181207 008
|
Automotive / Semiconductors
|
Dec 21, 2018
|
Iaculo, Massimo |
USA |
FSPUSA 191001 607
|
Automotive – Software
|
Oct 18, 2019
|
Ibanescu, Daniel |
Germany |
FSP DE210923 114
|
Automotive / Semiconductors
|
Oct 20, 2021
|
Ibayan, Ariel |
Australia |
FSPAUS 220727 007
|
Automotive
|
Jul 26, 2022
|
Ibnu Mulkam, Yulan |
Singapore |
FSPSG 211118 002
|
Process
|
Nov 22, 2021
|
Ibrahim, Khaled |
Germany |
FSP DE221114 602
|
Automotive
|
Mar 02, 2023
|
Ibrahim, Mohamed Hesham |
United Arab Emirates |
FSPME 230316 009
|
Process Hazard Analysis Using HAZOP
|
Apr 18, 2023
|
Ibrahim Al-Mohammadi, Abdullah |
Saudi Arabia |
FSPKSA 091019 010
|
Process Hazard Analysis using HAZOP
|
Jan 28, 2020
|
Ibrahim Al-Mohammadi, Abdullah |
Saudi Arabia |
FSPKSA 151019 006
|
HAZOP Facilitation
|
Jan 28, 2020
|
Iderzana, Zorig |
Mongolia |
FSPMNG 230308 014
|
Operations & Maintenance
|
Mar 29, 2023
|
Iheaka, Chuk |
USA |
FSPUSA 201112 002
|
SIL Verification with exSILentia
|
Nov 18, 2020
|
Ilardo, Santo |
Italy |
FSPIT 180504 016
|
Automotive
|
Jul 02, 2018
|
Iliat, Zahra |
Australia |
FSPAUS 220725 004
|
Operations & Maintenance
|
Jul 29, 2022
|
Imamovic, Suada |
Germany |
FSP DE231122 605
|
Automotive
|
Feb 07, 2024
|
Iman, Agus |
Indonesia |
FSPID 220712 001
|
Operations & Maintenance
|
Aug 01, 2022
|
Imani, Mina |
USA |
FSPUSA 191024 002
|
Process
|
Nov 06, 2019
|
Imani, Mina |
Canada |
FSPCAN 230614 005
|
SIL Verification with exSILentia
|
Sep 22, 2023
|
Indra, Jul |
Singapore |
FSPSG 230824 013
|
Process
|
Sep 12, 2023
|
Innes, Christopher |
Australia |
FSPAU 201118 004
|
Functional Safety Development
|
Nov 19, 2020
|
Inoue, Masatoshi |
USA |
FSPUSA 170609 039
|
Automotive / Semiconductors
|
Jun 14, 2017
|
Irfan, Mohammad |
USA |
FSPUSA 161208 013
|
Machine Safety
|
Dec 13, 2016
|
İriçağıl, Batuhan |
Germany |
FSPDE 180328 003
|
Process
|
Apr 02, 2018
|
Isaac, Bijoy |
USA |
FSPUSA 151105 006
|
Process
|
Feb 18, 2016
|
Ishaq, Imran |
Germany |
FSP DE220621 102
|
Automotive / Semiconductors
|
Aug 04, 2022
|
Ishii , Hiroyasu |
Belgium |
FSP DE200703 105
|
ISO 26262 Automotive / Semiconductors
|
Aug 02, 2020
|
Istas, Zoe |
USA |
FSP USA231213005
|
Process
|
Jan 03, 2024
|
İtil, İlyas |
Germany |
FSPDE 180328 005
|
Process
|
Apr 02, 2018
|
Itskovich, Ortal |
Germany |
FSP DE200727 601
|
Automotive
|
Oct 07, 2020
|
ITURBE ZABALETA, IÑIGO |
Spain |
FSPES 210504 016
|
Mechanical Functional Safety Development
|
May 13, 2021
|
Ivanov, Vlad |
Germany |
FSP DE230607 602
|
Automotive – Software
|
Jul 06, 2023
|
Iyer, Gomathy |
India |
FSPIN190124003
|
Process
|
Sep 06, 2019
|
Iyer, Aditya |
United Kingdom |
FSPUK 211008 001
|
Process Industry Hardware acc. to IEC 61508
|
Oct 20, 2021
|
J. Al-Qahtani, Mohammad |
Saudi Arabia |
FSPKSA 110919 001
|
Process Hazard Analysis using HAZOP
|
Jan 28, 2020
|
J. Hdadi, Ali |
Saudi Arabia |
FSPKSA 110919 010
|
Process Hazard Analysis using HAZOP
|
Jan 28, 2020
|
Jabshetty, Mallikarjuna |
India |
FSP DE230621 603
|
Automotive - Hardware
|
Jul 06, 2023
|
Jackman, Keone |
Trinidad and Tobago |
FSPTT 160922 004
|
Process
|
Oct 12, 2016
|
Jackson, Rick |
USA |
FSPUSA 181206 002
|
Process
|
Dec 17, 2018
|
Jackson, Jemima |
Australia |
FSPAU 220407 003
|
Machine Safety
|
Apr 12, 2022
|
Jackson, Glenn |
Australia |
FSPAU 231019 006
|
Machine Safety
|
Oct 30, 2023
|
Jackson-Haub, Luke |
Australia |
FSPAU 211023 001
|
Functional Safety Development
|
Dec 10, 2021
|
Jacob, Geogy |
USA |
FSPUSA 191010 022
|
Automotive / Semiconductors
|
Oct 18, 2019
|
Jacob, Maria Teresa |
Norway |
FSP NO220422 109
|
Automotive / Semiconductors
|
May 11, 2022
|
Jacques, Laurent |
Germany |
FSP DE221021 606
|
Automotive – Software
|
Mar 03, 2023
|
Jadhav, Mangesh |
USA |
FSP US231109 007
|
Software Functional Safety Development
|
Dec 06, 2023
|
Jaeckel, Bjoern |
Germany |
FSP DE230903 601
|
Automotive
|
Feb 06, 2024
|
Jagadeesh, Sambangi |
India |
FSPIN 170615 010
|
Process
|
Jun 19, 2017
|
Jahagirdar, Laxmikant |
Australia |
FSPAUS 220613 010
|
SIL Verification with exSILentia
|
Jul 07, 2022
|